PREPARATION AND APPLICATION
FOR PROFESSIONAL USE ONLY
Reference the floor covering and adhesive manufacturers documentation to verify suitability of StepSoft™ as an underlayment for the flooring system (any adhesive or mortar used for concrete is generally suitable for StepSoft™ ). Follow the directions of the flooring and adhesive manufacturer to determine the maximum allowable moisture content (RH) or Moisture Vapor Emission Rate (MVER) of the substrate. If the mois- ture content (ASTM F-2170) or Moisture Vapor Emission Rate (MVER) (ASTM F-1869) of the substrate exceeds the requirements of the flooring system, utilize an approved 100% epoxy moisture vapor mitigator prior to installation of StepSoft™ .
Honor all moving joints. Complete crack and substrate repairs prior to installation. Consult an engineer for required joints and crack repairs prior to installation. Contact Technical Services for required surface preparation on installations that will be exposed to high rolling loads or high point loads.
Maintain a minimum of 50ºF during the installation and for 72 hours afterwards. Acclimate the material to a minimum of 50ºF prior to installatio for at least 24 hours.
Consult technical services prior to using StepSoft™ with any floor heating systems to ensure the product is suitable for this application.
All Substrates must be sound, clean, dry and free of contaminants (oil, dirt, laitance etc.) that may interfere with adhesion. Areas of the floor that do not exhibit a tensile pull strength greater than 100 psi are not suitable and must be mechanically removed to a sound, stable base and subsequently repaired prior to application of StepSoft™ . Do not use solvents, acids or chemical adhesive removers to prepare the substrate. All bond breaking substances (cure residues,
excess salts from silicates etc.) must be removed prior to installation (unless using StepSoft™ in a floating application). Completely vacuum all dust and debris from the substrate prior to installation.
Gypsum substrates must exhibit a sound surface, be free from dust and surface weakness prior to application of StepSoft™ . All adhesives and potential bond breakers should be removed prior to installing StepSoft™ .
Wood floors must satisfy local building codes, utilize exterior grade plywood, suitable OSB or other resistant to water.
Installation Instructions:
StepSoft™ is meant for installation directly below the floor covering and should be installed using the same adhesives or mortars used to install the floor covering.
If the floor covering is utilized in a floating application, do not adhere StepSoft™ to the substrate and install the floor covering directly above StepSoft™ .
Perimeter isolation strips are recommended for the best acoustical performance. Carefully follow the isolation strip’s manufacturers instructions when installing the strips. Strips should be installed across the perimeter of the room and around any floor penetrations from plumbing, electrical, cabinetry, or other thresholds.
StepSoft™ should be installed flush with the strips with gaps no larger than 1/16”.
Install StepSoft™ using the same installation method as the floor covering. If, for example, you are using thin-set mortar: the same trowel size and mortar used to install the tile should be used to install the StepSoft™ . If a ¼” square notch trowel is required to install the tile: use a ¼” square not trowel to install StepSoft™ . The same is true of adhesive applications.
If installing StepSoft™ in a floating floor application, use a high quality carpet tape or duct tape to adhere the seams together to ensure a smooth substrate.
Once StepSoft™ is installed it is recommended a roller is used to ensure a uniform surface is achieved. It is recommended you wait for the adhesive or mortar to fully cure before installing the floor covering.
SEE DATA SHEET FOR COMPLETE INSTALLATION INSTRUCTIONS.
